boardsOur manufacturing operation is equipped with the resources required to provide services for the following:

Run Size

  • Prototype  
  • Small - medium volume 
  • High volume

Material

  • Turnkey
  • Consignment
  • Combination of Turnkey and Consignment

State-of-the-Art Processing

  • ANCI / IPC 610
  • Surface mount pick and place and reflow (Fine pitch and Ball Grid Array capabilities)
  • Automated Through Hole Insertion
  • RoHS and Non-RoHS wave soldering
  • Automated Optical Inspection
  • 100% visual inspection
  • In-Circuit and Functional Testing technical support

Highlights

  • ISO 9001
  • IPC-610 Class 1 & 2
  • RoHS Compliant
  • Automated Surface Mount Assembly
  • BGA/ µBGA Expertise
  • Automated Through Hole
  • Conformal Coating
  • Box Build
  • Turnkey Procurement
  • Competitive Pricing
  • On-time Delivery

Contact Us

 

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